IBM and 45nm Chip Development
IBM and Toppan Printing Co Ltd announced a $200 million deal to jointly develop a 45-nanometer chip making process aimed at production by mid-2007.
Specifically, the companies hope to develop a photomask process, which would be used to etch patterns of integrated circuits onto silicon wafers, to enable early production of advanced 45nm semiconductors.
IBM's PowerPC 970 was initially produced at a 130-nm manufacturing process while 90nm based PowerMacs were introduced in June 2004. Poor 90nm production yields has been cited for delays in PowerPC shipments and development.
Smaller manufacturing processes typically increase clock-speeds and decrease costs for the processors.
Popular Stories
Apple's long-rumored smart home hub will have an iMac G4-style design and a host of unique features, Bloomberg's Mark Gurman reports.
The smart home hub is said to feature a square 6-inch display, with variants that can be placed on a countertop or mounted on a wall. It features a single FaceTime camera on the front, with microphones and speakers in its connected base. Gurman described the...
Apple plans to introduce a series of new smart home products on Tuesday, October 13, according to Bloomberg's Mark Gurman.
Apple reportedly plans to debut its long-awaited smart home hub device, a new HomePod mini, and a new Apple TV on the date. The new HomePod mini and Apple TV are set to retain their existing designs, but tout faster chips to support Siri AI. The new HomePod mini will...
The iPhone Duo is reportedly facing production difficulties ahead of its October launch, with early output expected to be limited.
A person said to be close to Foxconn's supply chain told China's Jiemian News that final assembly yields for Apple's first foldable iPhone were only slightly above 60% as of September 17. The source said that, under Apple's current quality standards, it could...
