Appleinsider points out a slide that appeared on a Japanese news site.
The slide appears to provide a roadmap for IBM's Power Processors into 2006, with the Power 5 due this year, Power 5+ in 2005 and Power 6 in 2006.
The Power5+ appears to represent a die shrink to 90nm, while the Power6 is at 65nm.
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Updated with H2 chip for improved audio performance and new features.
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Siri improvements, optimizations for future foldable iPhone, and more. June introduction at WWDC with fall release.
Smarter Siri, touch optimizations for a future MacBook Pro, stability-focused updates, and more. June introduction at WWDC with fall release.
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